Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
US9105595B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105595-B2 |
| Application number | US-201113184879-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 18, 2011 |
| Priority date | Jul 30, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Official abstract text for this publication.
According to certain embodiments, a battery heating circuit is provided, comprising a switch unit 1 , a switching control module 100 , a damping component R 1 , and an energy storage circuit; the energy storage circuit is configured to be connected with the battery and comprises a current storage component L 1 and a charge storage component C 1 ; the damping component R 1 , the switch unit 1 , the current storage component L 1 , and the charge storage component C 1 are connected in series; the switching control module 100 is connected with the switch unit 1 , and is configured to control ON/OFF of the switch unit 1 , so as to control energy flowing from the battery to the energy storage circuit only. For example, the heating circuit provided in the present invention can improve the charge/discharge performance of the battery, and improve safety when the battery is heated.
Opening claim text (preview).
What is claimed is: 1. A circuit for heating a battery, the circuit comprising: the battery including a first damping component and a first current storage component, the first damping component and the first current storage component being parasitic to the battery, the battery including a first battery terminal and a second battery terminal; a switch unit; a switching control component coupled to the switch unit; and a first charge storage component, the first charge storag…
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