Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
Layered bonded structures formed from reactive bonding of zinc metal and zinc peroxide
US9105561B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105561-B2 |
| Application number | US-201213471306-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 14, 2012 |
| Priority date | May 14, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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A system, method, and apparatus for layered bonded structures formed from reactive bonding between zinc metal and zinc peroxide are disclosed herein. In particular, the present disclosure teaches a layered bonded structure wherein two structures are bonded together with a layer including zinc oxide. The zinc oxide is formed through a method that includes processing the two structures by contacting the structures under pressure and applying heat to the structures to promote a reaction with zinc peroxide and zinc metal on one or both of the two structures.
First claim
Opening claim text (preview).
I claim: 1. A method of forming a bonded layered structure, comprising: providing a first structure and a second structure; forming a first layer comprising zinc peroxide on at least one of the first and second structures; forming a second layer comprising zinc metal on at least one of the first and second structures; contacting the first and second structures such that the first layer contacts the second layer, such contact occurring between the first and second structures;…
Assignees
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Classifications
- H10P10/128Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- H10F77/123Primary
Electricity · mapped topic
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- What does patent US9105561B2 cover?
- A system, method, and apparatus for layered bonded structures formed from reactive bonding between zinc metal and zinc peroxide are disclosed herein. In particular, the present disclosure teaches a layered bonded structure wherein two structures are bonded together with a layer including zinc oxide. The zinc oxide is formed through a method that includes processing the two structures by contact…
- Who is the assignee on this patent?
- Woo Robyn L, Boeing Co
- What technology area does this patent fall under?
- Primary CPC classification H10P10/128. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).