Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9105534-B2
Application number	US-201414469752-A
Country	US
Kind code	B2
Filing date	Aug 27, 2014
Priority date	Dec 17, 2003
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings.

First claim

What is claimed is:

1. A semiconductor device comprising:
a substrate;
a first electrode;
a second electrode;
a first terminal that is electrically connected to the first electrode;
a second terminal that is electrically connected to the second electrode;
a first wiring that is electrically connected to the first electrode and the first terminal;
a second wiring that is electrically connected to the second electrode and the second terminal; and
a first insulating lay…

Assignees

• Seiko Epson Corp

Inventors

• Ito Haruki

Classifications

• H10W90/724

  Electricity · mapped topic

• H10W74/40

  Electricity · mapped topic

• H10W72/01235

  Electricity · mapped topic

• H10W72/01225

  Electricity · mapped topic

• H10W72/248

  Electricity · mapped topic