Oxide material and semiconductor device
US-2024395942-A1 · Nov 28, 2024 · US
US9105526B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105526-B2 |
| Application number | US-201314134571-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 19, 2013 |
| Priority date | Dec 19, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Methods for HPC techniques are applied to the processing of site-isolated regions (SIR) on a substrate to form at least a portion of a TFT device used in display applications. The processing may be applied to at least one of gate dielectric deposition, gate dielectric patterning, metal-based semiconductor (e.g. ZnO x , ZnSnO x , ZnInO x , or ZnGaO x ) deposition, metal-based semiconductor (e.g. ZnO x , ZnSnO x , ZnInO x , or ZnGaO x ) patterning, etch stop deposition, etch stop patterning, source/drain deposition, or source/drain patterning. The SIRs may be defined during the deposition process with uniform deposition within each SIR or the SIRs may be defined subsequent to the deposition of layers wherein the layers are deposited with a gradient in one or more properties across the substrate.
Opening claim text (preview).
What is claimed is: 1. A method for forming a plurality of thin film transistors on a substrate in a combinatorial manner, the method comprising: providing the substrate, wherein the substrate comprises a plurality of site-isolated regions, and wherein each site-isolate region further comprises one or more gate electrodes formed therein; depositing a gate dielectric layer above a surface of each site-isolated region; patterning the gate dielectric layer deposited above the sur…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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