Semiconductor memory device and manufacturing method of semiconductor memory device
US-2024313073-A1 · Sep 19, 2024 · US
US9105512B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105512-B2 |
| Application number | US-201414265129-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 29, 2014 |
| Priority date | Apr 24, 2009 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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A semiconductor device and method of manufacturing the same are provided. In one embodiment, semiconductor device includes a first oxide layer overlying a channel connecting a source and a drain formed in a substrate, a first nitride layer overlying the first oxide layer, a second oxide layer overlying the first nitride layer and a second nitride layer overlying the second oxide layer. A dielectric layer overlies the second nitride layer and a gate layer overlies the dielectric layer. The second nitride layer is oxygen-rich relative to the second nitride layer and includes a majority of the charge traps. Other embodiments are also described.
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What is claimed is: 1. A semiconductor device comprising: a first oxide layer overlying a channel connecting a source and a drain formed in a substrate; a first nitride layer overlying the first oxide layer; a second oxide layer overlying the first nitride layer; a second nitride layer overlying the second oxide layer; a dielectric layer overlying the second nitride layer; and a gate layer overlying the dielectric layer, wherein the first nitride layer is oxygen-rich r…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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