Methods of forming patterns of a semiconductor device
US-2015076617-A1 · Mar 19, 2015 · US
US9105510B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105510-B2 |
| Application number | US-201414461745-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 18, 2014 |
| Priority date | Dec 10, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Methodology enabling a generation of fins having a variable fin pitch less than 40 nm, and the resulting device are disclosed. Embodiments include: forming a hardmask on a substrate; providing first and second mandrels on the hardmask; providing a first spacer on each side of each of the first and second mandrels; removing the first and second mandrels; providing, after removal of the first and second mandrels, a second spacer on each side of each of the first spacers; and removing the first spacers.
Opening claim text (preview).
What is claimed is: 1. A device comprising: a substrate; a first fin in the substrate; a second fin in the substrate being separated from the first fin by a first distance; a third fin in the substrate being separated from the second fin by a second distance, and being separated from the first fin by the second fin, wherein the first and second distances are different; and a fourth fin in the substrate separated from the third fin by the first distance, the fourth fin bein…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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