Electronic component package and method for manufacturing electronic component package
US-2024090133-A1 · Mar 14, 2024 · US
Non-hermetic sealed multi-chip module package
US9105500B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105500-B2 |
| Application number | US-201213548232-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 13, 2012 |
| Priority date | Jul 13, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
Official abstract text for this publication.
A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane of the substrate surface.
First claim
Opening claim text (preview).
What is claimed is: 1. A multi-chip module (MCM) package, comprising: a substrate including a surface on which chips of the MCM are re-workable; and a hat assembly configured to be non-hermetically sealed to the substrate; a plurality of evenly arrayed plug and sealband interference fittings by which the substrate and the hat assembly are non-hermetically sealed to one another, the hat assembly being formed to define holes positionally corresponding to the fittings, and th…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10W76/60Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9105500B2 cover?
- A multi-chip module (MCM) package is provided and includes a substrate and a hat assembly. The substrate includes a surface on which chips of the MCM are re-workable. The hat assembly is configured to be non-hermetically sealed to the substrate. The hat assembly and the substrate are configured for tension-type disassembly in a dimension oriented substantially normally with respect to a plane o…
- Who is the assignee on this patent?
- Bodenweber Paul F, Toy Hilton T, Tunga Krishna R, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W76/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).