Metal gates for semiconductor devices and method thereof
US-2024429281-A1 · Dec 26, 2024 · US
US9105498B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105498-B2 |
| Application number | US-201213409630-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 1, 2012 |
| Priority date | Mar 1, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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A stack of a gate dielectric layer and a workfunction material layer are deposited over a plurality of semiconductor material portions, which can be a plurality of semiconductor fins or a plurality of active regions in a semiconductor substrate. A first gate conductor material applying a first stress is formed on a first portion of the workfunction material layer located on a first semiconductor material portion, and a second gate conductor material applying a second stress is formed on a second portion of the workfunction material layer located on a second semiconductor material portion. The first and second stresses are different in at least one of polarity and magnitude, thereby inducing different strains in the first and second portions of the workfunction material layer. The different strains cause the workfunction shift differently in the first and second portions of the workfunction material layer, thereby providing devices having multiple different workfunctions.
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What is claimed is: 1. A method of forming a semiconductor structure comprising: forming a stack of a gate dielectric layer and a workfunction material layer over a first semiconductor material portion and a second semiconductor material portion; forming a first gate conductor material layer applying a first stress to a first workfunction material portion of said workfunction material layer that is present over said first semiconductor material portion, wherein said first workfu…
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