Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9105489B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105489-B2 |
| Application number | US-201313875733-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 2, 2013 |
| Priority date | May 2, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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A power semiconductor module includes a base plate and at least one pair of substrates mounted on the base plate. Multiple power semiconductors are mounted on each substrate. The power semiconductors are arranged on each substrate with a different number of power semiconductors along opposite edges thereof. The at least one pair of substrates is arranged on the base plate with the respective edges of the substrates provided with a lower number of power semiconductors facing towards each other.
Opening claim text (preview).
What is claimed is: 1. A power semiconductor module comprising: a base plate; and at least one pair of substrates mounted on the base plate, wherein: each substrate has a rectangular shape; multiple power semiconductors are mounted on each substrate, the power semiconductors are arranged on each substrate with a different number of power semiconductors along opposite edges of the substrate; the at least one pair of substrates is arranged on the base plate with the respec…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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