SiC semiconductor device
US-12080760-B2 · Sep 3, 2024 · US
US9105486B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105486-B2 |
| Application number | US-201414150477-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 8, 2014 |
| Priority date | Apr 5, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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A semiconductor device includes a first conductive type semiconductor substrate, a second conductive type active region formed on a top surface side of the semiconductor substrate, a second conductive type inside VLD region formed to contact the active region on the top surface side in a plan view, and a second conductive type well region formed to contact a portion opposite to the portion contacting the active region of the inside VLD region on the top surface side in a plan view. The well region is formed to be deeper than the active region. The inside VLD region has the same depth as that of the active region in the portion contacting the active region, the depth gradually increasing from the active region toward the well region and becoming the same as the depth of the well region in the portion contacting the well region.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a first conductive type semiconductor substrate; a second conductive type active region formed on a top surface side of the semiconductor substrate; a second conductive type inside VLD region formed so as to contact the active region on a top surface side of the semiconductor substrate in a plan view; and a second conductive type well region formed so as to contact a portion opposite to the portion contacting the acti…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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