Semiconductor device
US-2019355591-A1 · Nov 21, 2019 · US
US9105468B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105468-B2 |
| Application number | US-201314020647-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2013 |
| Priority date | Sep 6, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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A 3D memory array having a vertically oriented thin film transistor (TFT) selection device that has a body formed from a wide energy band gap semiconductor is disclosed. The wide energy band gap semiconductor may be an oxide semiconductor, such as a metal oxide semiconductor. As examples, this could be an InGaZnO, InZnO, HfInZnO, or ZnInSnO body. The source and drains can also be formed from the wide energy band gap semiconductor, although these may be doped for better conduction. The vertically oriented TFT selection device serves as a vertical bit line selection device in the 3D memory array. A vertical TFT select device has a high drive current, a high breakdown voltage and low leakage current.
Opening claim text (preview).
What is claimed is: 1. A non-volatile storage system, comprising: a substrate that extends horizontally; a three dimensional memory array of memory cells; a plurality of word lines coupled to the memory cells; a plurality of global bit lines; a plurality of vertically oriented bit lines coupled to the memory cells, wherein the vertically oriented bit lines are oriented vertically with respect to the substrate; a plurality of vertically oriented thin film transistor (TFT)…
Electricity · mapped topic
Electricity · mapped topic
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