RFID assembly and assembly method thereof
US-12153983-B2 · Nov 26, 2024 · US
US9104955B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9104955-B2 |
| Application number | US-201313931929-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 30, 2013 |
| Priority date | Jun 7, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for cutting or nicking the wire. Insulation may be removed from a portion of the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.
Opening claim text (preview).
What is claimed is: 1. A sonotrode for mounting an antenna wire to an inlay substrate for a transponder, comprising: a capillary having a supply end, a delivery end, and an internal bore through which the wire passes; a clamping mechanism for holding the wire relative to the capillary; a cutting mechanism for at least partially severing the wire; wherein: the cutting mechanism is disposed before the capillary. 2. The sonotrode of claim 1 , wherein: the clamping mechanism is disposed before the capillary. 3. The sonotrode of claim 1 , wherein: the cutting mechanism is disposed between the capillary and the clamping mechanism. 4. The sonotrode of claim 1 , further comprising: means for removing insulation from the wire where it is partially severed. 5. The sonotrode of claim 1 , wherein: the cutting mechanism severs the wire. 6. The sonotrode of claim 1 , further comprising: a laser for removing insulation from the wire. 7. The sonotrode of claim 6 , wherein: insulation is removed from the wire either above or below the cutting mechanism.
the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title
with deforming of conductive path · CPC title
On flat or curved insulated base, e.g., printed circuit, etc. · CPC title
Means to assemble electrical device · CPC title
Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title
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