Sonotrode with cutting mechanism

US9104955B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9104955-B2
Application numberUS-201313931929-A
CountryUS
Kind codeB2
Filing dateJun 30, 2013
Priority dateJun 7, 2010
Publication dateAug 11, 2015
Grant dateAug 11, 2015

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for cutting or nicking the wire. Insulation may be removed from a portion of the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A sonotrode for mounting an antenna wire to an inlay substrate for a transponder, comprising: a capillary having a supply end, a delivery end, and an internal bore through which the wire passes; a clamping mechanism for holding the wire relative to the capillary; a cutting mechanism for at least partially severing the wire; wherein: the cutting mechanism is disposed before the capillary. 2. The sonotrode of claim 1 , wherein: the clamping mechanism is disposed before the capillary. 3. The sonotrode of claim 1 , wherein: the cutting mechanism is disposed between the capillary and the clamping mechanism. 4. The sonotrode of claim 1 , further comprising: means for removing insulation from the wire where it is partially severed. 5. The sonotrode of claim 1 , wherein: the cutting mechanism severs the wire. 6. The sonotrode of claim 1 , further comprising: a laser for removing insulation from the wire. 7. The sonotrode of claim 6 , wherein: insulation is removed from the wire either above or below the cutting mechanism.

Assignees

Inventors

Classifications

  • the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

  • with deforming of conductive path · CPC title

  • On flat or curved insulated base, e.g., printed circuit, etc. · CPC title

  • Means to assemble electrical device · CPC title

  • Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title

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What does patent US9104955B2 cover?
During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for cutting or nicking the wire. Insulation may be removed from a portion of the wire. The antenna may comprise two separate stubs, each having an…
Who is the assignee on this patent?
Finn David, Feinics Amatech Teoranta
What technology area does this patent fall under?
Primary CPC classification G06K19/07722. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).