Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US9104112B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9104112-B2 |
| Application number | US-201113823206-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2011 |
| Priority date | Sep 30, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Provided is a mask blank that is improved in adhesion of a thin film for forming a transfer pattern to a resist, thus capable of suppressing the occurrence of collapse, chipping, or the like of a formed resist pattern. The mask blank has, on a transparent substrate 1 , a thin film 2 which is for forming a transfer pattern and is made of a material containing a metal. The thin film 2 has a surface modified layer in the form of an oxide film containing a hydrocarbon. The surface modified layer of the thin film 2 can be formed by, for example, causing a highly concentrated ozone gas and an unsaturated hydrocarbon gas to act on the thin film.
Opening claim text (preview).
The invention claimed is: 1. A mask blank comprising: a substrate; and a thin film which is formed on the substrate and which is for forming a transfer pattern and made of a material containing a metal, wherein the thin film has a surface modified layer comprising an oxide film containing a hydrocarbon. 2. The mask blank according to claim 1 , wherein the thin film is a laminated film and an uppermost layer of the laminated film is made of a material con…
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