Testing of semiconductor chips with microbumps
US-2015362526-A1 · Dec 17, 2015 · US
US9103876B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9103876-B2 |
| Application number | US-201113521034-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 7, 2011 |
| Priority date | Jan 8, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Official abstract text for this publication.
A probe system for facilitating the inspection of a device under test. System incorporates a storage rack; a probe bar gantry assembly; a probe assembly configured to electrically mate the device under test; and a robot system for picking the probe assembly from the storage rack and deliver the probe assembly to the probe bar gantry. The robot system is also enabled to pick a probe assembly from the probe bar gantry and deliver the probe assembly to the storage rack. The probe assembly includes a clamping assembly for attaching the probe assembly to the probe bar gantry or the storage rack. The probe assembly may include an array of contact pins configured to mate with conductive pads on the device under test when the probe assembly is installed on the probe bar gantry assembly.
Opening claim text (preview).
What is claimed is: 1. A probe system for inspection of a device under test, the probe system comprising: a. a storage rack; b. a probe bar gantry assembly; c. a probe assembly configured to electrically mate the device under test; and d. a robot system configured to pick the probe assembly from the storage rack and deliver the probe assembly to the probe bar gantry, the robot system being further configured to pick a probe assembly from the probe bar gantry and deliver the…
Physics · mapped topic
Physics · mapped topic
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