Measuring apparatus, on-chip instrumentation device and measuring method
US-12181278-B2 · Dec 31, 2024 · US
Method and device for identifying a material
US9103774B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9103774-B2 |
| Application number | US-201013504239-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 25, 2010 |
| Priority date | Oct 27, 2009 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A material may be identified using THz radiation that simultaneously or sequentially includes at least one first frequency portion and a second frequency portion different therefrom. An object formed from the material to be identified is irradiated with the THz radiation and the THz radiation exiting the object is detected using a phase-sensitive THz receiver. A time or phase offset, caused by the object, is measured at least for the first frequency portion and a material thickness is determined therefrom. Attenuation of the received signal, at least for the second frequency portion, is determined. An absorption coefficient for at least the second frequency portion is calculated using the material thickness.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of identifying a material from a class of materials that are transparent to THz radiation, the method comprising: producing THz radiation via a THz emitter, the THz radiation simultaneously or sequentially containing at least one first frequency component and a second frequency component of a wavelength which is different from the first frequency component, wherein absorption of the first frequency component of the THz radiation is lower than…
Assignees
Inventors
Classifications
- G01N21/3581Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9103774B2 cover?
- A material may be identified using THz radiation that simultaneously or sequentially includes at least one first frequency portion and a second frequency portion different therefrom. An object formed from the material to be identified is irradiated with the THz radiation and the THz radiation exiting the object is detected using a phase-sensitive THz receiver. A time or phase offset, caused by …
- Who is the assignee on this patent?
- Sartorius Bernd, Roehle Helmut, Stanze Dennis, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification G01N21/3581. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).