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Heat dissipation device assembly structure
US9103601B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9103601-B2 |
| Application number | US-201213469735-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 11, 2012 |
| Priority date | May 11, 2012 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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A heat dissipation device assembly structure includes a heat dissipation unit and at least one fastening member. The heat dissipation unit has a bottom face and a locating section. The locating section is formed with at least one channel in communication with the bottom face. The fastening member is assembled on the bottom face. The fastening member has at least one latch section correspondingly inserted in the locating section. The fastening member further has at least one locking section on one side of the fastening member, which side is distal from the bottom face. The fastening member can be quickly assembled with the heat dissipation unit by means of inserting the latch section into the locating section of the heat dissipation unit. The heat dissipation device assembly structure has higher heat dissipation efficiency and is free from welding process so that the welding cost is saved.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat dissipation device assembly structure comprising: a heat dissipation unit consisting of a plurality of fins and having a bottom face, a locating section and multiple through holes, the locating section being formed with at least one L-shaped channel in communication with the bottom face; a fastening member assembled on the bottom face, the fastening member having at least one latch section correspondingly inserted in the locating section, the fasten…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- F28D15/0275Primary
Mechanical Engineering · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9103601B2 cover?
- A heat dissipation device assembly structure includes a heat dissipation unit and at least one fastening member. The heat dissipation unit has a bottom face and a locating section. The locating section is formed with at least one channel in communication with the bottom face. The fastening member is assembled on the bottom face. The fastening member has at least one latch section correspondingl…
- Who is the assignee on this patent?
- Liu Jin-Hsun, Chen Chih-Ming, Asia Vital Components Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification F28D15/0275. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).