Microchannel cooler for light emitting diode light fixtures

US9103544B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9103544-B2
Application numberUS-201414490243-A
CountryUS
Kind codeB2
Filing dateSep 18, 2014
Priority dateJun 3, 2010
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A lighting module has an array of light emitters, a heat sink having a first surface, the array of light emitters being mounted to the first surface, a microchannel cooler arranged on a second surface of the heat sink on an opposite side of the heat sink from the first surface, the microchannel cooler arranged to transport a liquid through a channel on the second surface of the heat sink, and a cooling unit thermally coupled to a microchannel cooler and arranged to remove heat from the liquid.

First claim

Opening claim text (preview).

The invention claimed is: 1. A lighting system, comprising: an array of light emitters, arranged on a first surface of a substrate; one or more microchannel coolers mounted behind the array on an opposite side of the substrate, the one or more microchannel coolers including an input port to allow a liquid to enter the one or more microchannel coolers and flow through microchannels in the one or more microchannel coolers, and an output port to exhaust the liquid after flowing thr…

Assignees

Inventors

Classifications

  • F21V29/30Primary

    Mechanical Engineering · mapped topic

  • F21V29/58Primary

    Mechanical Engineering · mapped topic

  • Mechanical Engineering · mapped topic

  • Mechanical Engineering · mapped topic

  • Mechanical Engineering · mapped topic

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Frequently asked questions

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What does patent US9103544B2 cover?
A lighting module has an array of light emitters, a heat sink having a first surface, the array of light emitters being mounted to the first surface, a microchannel cooler arranged on a second surface of the heat sink on an opposite side of the heat sink from the first surface, the microchannel cooler arranged to transport a liquid through a channel on the second surface of the heat sink, and a…
Who is the assignee on this patent?
Phoseon Technology Inc
What technology area does this patent fall under?
Primary CPC classification F21V29/30. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).