Prepreg, metal-clad laminate, and printed wiring board

US9102850B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9102850-B2
Application numberUS-201414389525-A
CountryUS
Kind codeB2
Filing dateMar 11, 2014
Priority dateMar 13, 2013
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group. The inorganic filler (C) is subjected to surface-treatment with a silane coupling agent represented by a general formula: YSiX 3 , wherein X represents a methoxy group or an ethoxy group, and Y represents an aliphatic alkyl group having 6 to 18 carbon atoms.

First claim

Opening claim text (preview).

The invention claimed is: 1. A prepreg formed from a resin composition and a fabric substrate impregnated with the resin composition, the resin composition comprising: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler, the resin (B) having the Tg not more than 100° C. having: a carbonyl group or a siloxane group; and an epoxy group or a phenolic hydroxyl group, the inorganic filler (C) being subjected t…

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What does patent US9102850B2 cover?
The prepreg in accordance with the present invention is formed from a resin composition and a fabric substrate impregnated with the resin composition. The resin composition contains: (A) a thermosetting resin composition; (B) a resin having a Tg not more than 100° C.; and (C) an inorganic filler. The resin (B) having the Tg not more than 100° C. has: a carbonyl group or a siloxane group; and an…
Who is the assignee on this patent?
Panasonic Corp, Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification C09D163/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).