Microfluidic chips and methods of producing microfluidic chips
US-2024351025-A1 · Oct 24, 2024 · US
Controlled fluid delivery in a microelectronic package
US9101931B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9101931-B2 |
| Application number | US-96656007-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 28, 2007 |
| Priority date | Dec 28, 2007 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus, comprising: a substrate having a hollow defining space into which a die having a fluidic channel is positioned for processing fluids, wherein the die is positioned in the space so that a top surface thereof is flush with a top surface of the substrate; a first coating patterned on the substrate; a cover fit over the substrate; a second coating patterned on the cover, wherein the first coating and the second coating define a fluid flow pat…
Assignees
Inventors
Classifications
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9101931B2 cover?
- A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may co…
- Who is the assignee on this patent?
- Supriya Lakshmi, Matayabas Jr James C, Chakrapani Nirupama, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B01L3/502707. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).