Cooling unit and electronic equipment

US9101079B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9101079-B2
Application numberUS-201313969061-A
CountryUS
Kind codeB2
Filing dateAug 16, 2013
Priority dateSep 7, 2012
Publication dateAug 4, 2015
Grant dateAug 4, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.

First claim

Opening claim text (preview).

The invention claimed is: 1. A cooling unit that cools a plurality of heat-generating components in electronic equipment, comprising: a radiator; a supply pipe which is connected to the radiator, and in which a refrigerant that is air-cooled by the radiator flows; a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components; a plurality of heat receiving units that are mounted to the respective plurality of h…

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Frequently asked questions

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What does patent US9101079B2 cover?
A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected …
Who is the assignee on this patent?
Fujitsu Ltd
What technology area does this patent fall under?
Primary CPC classification H05K7/20263. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).