Semiconductor device
US-2024421022-A1 · Dec 19, 2024 · US
Electronic component package with a heat conductor
US9101077B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9101077-B2 |
| Application number | US-201213722282-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2012 |
| Priority date | Dec 20, 2011 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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Abstract
Official abstract text for this publication.
An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic component package comprising: a support comprising metal tracks within the support; a heat conductor; and a conductive column disposed in the support and coupled to the metal tracks; wherein the heat conductor has a first protuberance and a second protuberance, and the support has a first socket and a second socket arranged to be able to receive the first protuberance and the second protuberance, respectively; the first socket and the…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W40/778Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9101077B2 cover?
- An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.
- Who is the assignee on this patent?
- St Microelectronics Grenoble 2
- What technology area does this patent fall under?
- Primary CPC classification H10W40/778. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).