Two-stage power delivery architecture

Patent metadata

Field	Value
Publication number	US-9101068-B2
Application number	US-201313830033-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 14, 2013
Publication date	Aug 4, 2015
Grant date	Aug 4, 2015

Abstract

A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

First claim

What is claimed is:

1. A two-stage power delivery network, comprising:
a voltage regulator;
an interposer comprising a packaging substrate having an embedded inductor including a plurality of traces and a plurality of through substrate vias at opposing ends of the plurality of traces, the interposer coupled to the voltage regulator;
a semiconductor die supported by the packaging substrate; and
a metal-insulator-metal capacitor directly on the packaging substrate and embedded…

Assignees

• Qualcomm Inc

Inventors

• Yun Changhan
• Carobolante Francesco
• Zuo Chengjie
• Kim Jonghae
• Velez Mario Francisco
• Smith Lawrence D
• Nowak Matthew M

Classifications

• H10W90/00

  Electricity · mapped topic

• H10W90/724

  Electricity · mapped topic

• H10W90/701

  Electricity · mapped topic

• H10W70/63

  Electricity · mapped topic

• H10W70/685

  Electricity · mapped topic