Method of manufacturing printed circuit board
US-2024414849-A1 · Dec 12, 2024 · US
Thin film electrode ceramic substrate and method for manufacturing the same
US9101064B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9101064-B2 |
| Application number | US-201213548575-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 13, 2012 |
| Priority date | Aug 5, 2011 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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- Title
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Abstract
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Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.
First claim
Opening claim text (preview).
What is claimed is: 1. A thin film electrode ceramic substrate, comprising: a ceramic substrate; a plurality of anti-etching metal layers formed in a surface of the ceramic substrate; a thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein the anti-etching metal layers are extant under respective edge portions of the thin film electrode pattern and extends, in the ceramic substrate, a dis…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9101064B2 cover?
- Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherei…
- Who is the assignee on this patent?
- Yoo Won Hee, Chang Byeung Gyu, Lee Taek Jung, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H05K3/06. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).