Circuit module having electrical shield

Patent metadata

Field	Value
Publication number	US-9101050-B2
Application number	US-201314090387-A
Country	US
Kind code	B2
Filing date	Nov 26, 2013
Priority date	Aug 13, 2013
Publication date	Aug 4, 2015
Grant date	Aug 4, 2015

Abstract

A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.

First claim

What is claimed is:

1. A circuit module, comprising:
a circuit substrate having a mount surface;
a mount component mounted on the mount surface;
a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface, the trench including a side wall configured of a first section at a mount surface side and a second section at a main surface side, the first section and the…

Assignees

• Taiyo Yuden Kk

Inventors

• Shimamura Masaya
• Kitazaki Kenzo
• Mugiya Eiji
• Sawatari Tatsuro
• Saji Tetsuo
• Nakamura Hiroshi

Classifications

• H10W90/724

  Electricity · mapped topic

• H10W74/10

  Electricity · mapped topic

• H10W74/00

  Electricity · mapped topic

• H10W72/0198

  Electricity · mapped topic

• H10W74/121

  Electricity · mapped topic