Electronic control of a compressor, compressor and cooling equipment
US-12144153-B2 · Nov 12, 2024 · US
Printed wiring board and method of manufacturing printed wiring board
US9101048B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9101048-B2 |
| Application number | US-201313742669-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 16, 2013 |
| Priority date | Jan 30, 2012 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A printed wiring board includes an insulative substrate, a wiring portion which is formed on a surface of the insulative substrate and has a predetermined wiring pattern, an insulative layer which is formed on the wiring portion and on which a part of the wiring layer is exposed as a terminal, a radiator plate provided on another surface of the insulative substrate, and a heat conductive portion which is formed inside the through hole penetrating through the surface and the other surface of the insulative substrate and connected to the wiring portion.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed wiring board comprising: an insulative substrate; a wiring portion which is formed on a surface of the insulative substrate and includes a plurality of wiring patterns each extending in a longitudinal direction and a lateral direction, the wiring patterns being arranged in the lateral direction so that a predetermined gap is interposed between adjacent longitudinal sides, which are respectively included in the adjacent wiring patterns and extend…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9101048B2 cover?
- A printed wiring board includes an insulative substrate, a wiring portion which is formed on a surface of the insulative substrate and has a predetermined wiring pattern, an insulative layer which is formed on the wiring portion and on which a part of the wiring layer is exposed as a terminal, a radiator plate provided on another surface of the insulative substrate, and a heat conductive portio…
- Who is the assignee on this patent?
- Shinko Electric Ind Co
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0201. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).