Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Patent metadata

Field	Value
Publication number	US-9099539-B2
Application number	US-201113037785-A
Country	US
Kind code	B2
Filing date	Mar 1, 2011
Priority date	Aug 31, 2006
Publication date	Aug 4, 2015
Grant date	Aug 4, 2015

Abstract

Microfeature workpieces having interconnects and conductive backplanes and associated systems and methods are disclosed herein. One such device includes a semiconductor substrate having integrated circuitry and terminals electrically coupled to the integrated circuitry. The device also includes electrically conductive interconnects extending through at least a portion of the semiconductor substrate and electrically coupled to corresponding terminals. The device further includes a conductive backplane assembly having a conductive layer at a back side of the semiconductor substrate. One or more of the interconnects are electrically coupled to the conductive layer at the back side of the semiconductor substrate.

First claim

I claim:

1. A method of processing a semiconductor substrate, the semiconductor substrate having integrated circuitry and a plurality of terminals electrically coupled to the integrated circuitry, the method comprising:
forming a plurality of electrically conductive interconnects extending at least partially through the substrate and in contact with corresponding terminals, the interconnects having back side portions at a back side of the semiconductor substrate;
constructing a…

Assignees

• Tuttle Mark E
• Micron Technology Inc

Inventors

• Tuttle Mark E

Classifications

• H10W90/732

  Electricity · mapped topic

• H10W90/722

  Electricity · mapped topic

• H10W90/297

  Electricity · mapped topic

• H10W72/9226

  Electricity · mapped topic

• H10W72/952

  Electricity · mapped topic