Substrate treatment method and substrate treatment apparatus
US-2024162032-A1 · May 16, 2024 · US
Substrate treatment apparatus, and substrate treatment method
US9099504B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9099504-B2 |
| Application number | US-36294509-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2009 |
| Priority date | Jan 31, 2008 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The substrate treatment apparatus according to the present invention includes a substrate holding mechanism which holds a substrate, a nozzle body having a spout which spouts an etching liquid toward a major surface of the substrate held by the substrate holding mechanism, a nozzle body movement mechanism which moves the nozzle body in a predetermined movement direction so as to move an etching liquid application position at which the etching liquid is applied on the major surface, a first flexible sheet attached to the nozzle body to be brought into contact with a portion of the major surface located on one of opposite sides of the etching liquid application position with respect to the movement direction, and a second flexible sheet attached to the nozzle body to be brought into contact with a portion of the major surface located on the other side of the etching liquid application position with respect to the movement direction.
First claim
Opening claim text (preview).
What is claimed is: 1. A substrate treatment apparatus comprising: a substrate holding mechanism which holds a substrate; a nozzle body having a spout which spouts an etching liquid toward a major surface of the substrate held by the substrate holding mechanism; a nozzle body movement mechanism which moves the nozzle body in a predetermined movement direction so as to move an etching liquid application position at which the etching liquid spouted by the nozzle body reaches the…
Assignees
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Classifications
- H10P72/0424Primary
Electricity · mapped topic
Operations & Transport · mapped topic
Physics · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9099504B2 cover?
- The substrate treatment apparatus according to the present invention includes a substrate holding mechanism which holds a substrate, a nozzle body having a spout which spouts an etching liquid toward a major surface of the substrate held by the substrate holding mechanism, a nozzle body movement mechanism which moves the nozzle body in a predetermined movement direction so as to move an etching…
- Who is the assignee on this patent?
- Nada Kazunari, Arai Kenichiro, Screen Holdings Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0424. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).