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Integrated circuit with ion sensitive sensor and manufacturing method
US9099486B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9099486-B2 |
| Application number | US-201313920874-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 18, 2013 |
| Priority date | Jun 19, 2012 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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Abstract
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Disclosed is an integrated circuit comprising a substrate ( 10 ) carrying plurality of circuit elements ( 20 ); a metallization stack ( 30 ) over said substrate for providing interconnections to at least some of said circuit elements, the metallization stack comprising a plurality of patterned metal layers ( 31 ) spatially separated from each other by respective electrically insulating layers ( 32 ), at least some of said electrically insulating layers comprising conductive portions ( 33 ) that electrically interconnect portions of adjacent metal layers, wherein at least one of the patterned metallization layers comprises a plurality of ion-sensitive electrodes ( 34 ), each ion-sensitive electrode being electrically connected to at least one of said circuit elements, a plurality of sample volumes ( 50 ) extending into said metallization stack, each sample volume terminating at one of said ion-sensitive electrodes; and an ion-sensitive layer lining at least the ion-sensitive electrodes in said sample volumes. A method of manufacturing such an IC is also disclosed.
First claim
Opening claim text (preview).
The invention claimed: 1. An integrated circuit comprising: a substrate carrying plurality of circuit elements; a metallization stack over said substrate for providing interconnections to at least some of said circuit elements, the metallization stack comprising a plurality of patterned metal layers spatially separated from each other by respective electrically insulating layers, at least some of said electrically insulating layers comprising conductive portions that electricall…
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Classifications
Physics · mapped topic
- G01N27/4145Primary
Physics · mapped topic
Electricity · mapped topic
- H10D48/30Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9099486B2 cover?
- Disclosed is an integrated circuit comprising a substrate ( 10 ) carrying plurality of circuit elements ( 20 ); a metallization stack ( 30 ) over said substrate for providing interconnections to at least some of said circuit elements, the metallization stack comprising a plurality of patterned metal layers ( 31 ) spatially separated from each other by respective electrically insulating layers (…
- Who is the assignee on this patent?
- Nxp Bv, Nxp Bv
- What technology area does this patent fall under?
- Primary CPC classification G01N27/4145. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).