Semiconductor device and fabrication method thereof
US-12159906-B2 · Dec 3, 2024 · US
US9099433B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9099433-B2 |
| Application number | US-201213453127-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 23, 2012 |
| Priority date | Apr 23, 2012 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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A low leakage current switch device ( 110 ) is provided which includes a GaN-on-Si substrate ( 11 - 13 ) covered by a passivation surface layer ( 43 ) in which a T-gate electrode with sidewall extensions ( 48 ) is formed and coated with a conformal passivation layer ( 49 ) so that the T-gate electrode sidewall extensions are spaced apart from the underlying passivation surface layer ( 43 ) by the conformal passivation layer ( 49 ).
Opening claim text (preview).
What is claimed is: 1. A method of forming gallium nitride transistor, comprising: providing a substrate with a gallium nitride layer covered by a passivation surface layer; forming a mask with a first mask opening overlying the passivation surface layer; etching the passivation surface layer using the first mask opening in the mask to expose a gate contact surface of the substrate under the first mask opening; forming a conductive gate electrode comprising a contact base po…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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