Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Stacked microelectronic assembly with TSVS formed in stages with plural active chips
US9099296B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9099296-B2 |
| Application number | US-201314060997-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 23, 2013 |
| Priority date | Dec 2, 2010 |
| Publication date | Aug 4, 2015 |
| Grant date | Aug 4, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.
First claim
Opening claim text (preview).
The invention claimed is: 1. A microelectronic assembly, comprising: a first microelectronic element having a front surface and a first electrically conductive pad exposed at the front surface, and a first electrically conductive element extending along the front surface away therefrom; a second microelectronic element having a front surface facing the front surface of the first microelectronic element, and a second electrically conductive pad exposed at the front surface and ju…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9099296B2 cover?
- A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectro…
- Who is the assignee on this patent?
- Tessera Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).