Property measurement apparatus and property measurement method

Patent metadata

Field	Value
Publication number	US-9097635-B2
Application number	US-201213371881-A
Country	US
Kind code	B2
Filing date	Feb 13, 2012
Priority date	May 29, 2008
Publication date	Aug 4, 2015
Grant date	Aug 4, 2015

Abstract

Disclosed herein is a property measurement apparatus including: a first plate installed in a state of being rotatable and/or vibratable; and a second plate placed to face the first plate and provided with an impedance measurement section, wherein a stress caused by a distortion generated by rotating or vibrating the first plate to serve as a distortion given to a sample provided in a gap between the first and second plates is measured, and at the same time, the impedance measurement section measures the impedance of the sample.

First claim

What is claimed is:

1. A method of property measurement comprising:
inserting a sample between a first plate and a second plate;
causing stress in the sample disposed between the first plate and the second plate;
measuring a dynamic viscoelasticity of the sample based on the stress caused in the sample;
applying a voltage between a first conductive layer and a second conductive layer of the second plate, the first conductive layer having a layer breaking gap within which a p…

Assignees

• Hayashi Yoshihito
• Sony Corp

Inventors

• Hayashi Yoshihito

Classifications

• G01N11/165

  Physics · mapped topic

• G01N11/142 Primary

  Physics · mapped topic

• G01N2011/0066

  Physics · mapped topic