Conformal oxide dry etch

Patent metadata

Field	Value
Publication number	US-9093390-B2
Application number	US-201414314889-A
Country	US
Kind code	B2
Filing date	Jun 25, 2014
Priority date	Mar 7, 2013
Publication date	Jul 28, 2015
Grant date	Jul 28, 2015

Abstract

A method of etching silicon oxide from a trench is described which allows more homogeneous etch rates up and down the sides of the trench. One disclosed method includes a sequential introduction of (1) a hydrogen-containing precursor and then (2) a fluorine-containing precursor into a substrate processing region. The temperature of the substrate is low during each of the two steps in order to allow the reaction to proceed and form solid residue by-product. A second disclosed method reverses the order of steps (1) and (2) but still forms solid residue by-product. The solid residue by-product is removed by raising the temperature in a subsequent sublimation step regardless of the order of the two steps.

First claim

What is claimed is:

1. A method of etching silicon oxide from the walls of a trench on a surface of a patterned substrate in a substrate processing chamber, the chamber having a substrate processing region and a plasma generating region remote from the substrate processing region, the method comprising:
exposing the patterned substrate to hydrogen by flowing a hydrogen-containing precursor into the substrate processing region,
removing process effluents including unadsorbed hydrogen-containing precursor from the substrate processing region,
exposing the patterned substrate to hydrogen-free fluorine by flowing a fluorine-containing precursor into the substrate processing region to form solid by-products on the patterned substrate, and
removing process effluents including unreacted fluorine-containing precursor from the substrate processing region; and
raising a temperature of the substrate above a sublimation temperature to remove the solid by-products, wherein the sublimation operation occurs after the step of exposing the patterned substrate to fluorine, and wherein the at least four sequential steps in combination with the sublimation operation are referred to collectively as an etch cycle.

2. The method of claim 1 wherein the operations are repeated until a target thickness of the silicon oxide layer is removed.

3. The method of claim 1 wherein the hydrogen-containing precursor is fluorine-free.

4. The method of claim 1 wherein a temperature of the patterned substrate is below 90° C. during the steps of exposing the patterned substrate to hydrogen and exposing the patterned substrate to fluorine.

5. The method of claim 1 wherein the sublimation temperature is greater than 90° C.

6. The method of claim 1 wherein the silicon oxide which forms a wall of the trench is heterogeneous in terms of deposition method but the etch cycle removes between 4 Å and 11 Å of the silicon oxide despite the differing deposition methods.

7. The method of claim 1 wherein the hydrogen-containing precursor is passed through a remote plasma before entering the substrate processing region.

8. The method of claim 1 wherein the fluorine-containing precursor is passed through a remote plasma before entering the substrate processing region.

9. The method of claim 1 wherein the hydrogen-containing precursor comprises at least one precursor selected from the group consisting of atomic hydrogen, molecular hydrogen and ammonia.

10. The method of claim 1 wherein the fluorine-containing precursor comprises at least one precursor selected from the group consisting of nitrogen trifluoride, hydrogen fluoride, diatomic fluorine, monatomic fluorine.

11. A method of etching silicon oxide from the walls of a trench on a surface of a patterned substrate in a substrate processing chamber, the chamber having a substrate processing region and a plasma generating region remote from the substrate processing region, the method comprising
(i) exposing the patterned substrate to hydrogen-free fluorine by flowing a fluorine-containing precursor into the substrate processing region,
(ii) removing process effluents including unadsorbed fluorine-containing precursor from the substrate processing region,
(iii) exposing the patterned substrate to hydrogen by flowing a hydrogen-containing precursor into the substrate processing region to form solid by-products on the patterned substrate, and
(iv) removing process effluents including unreacted hydrogen-containing precursor from the substrate processing region; and
raising a temperature of the substrate above a sublimation temperature to remove the solid by-products, wherein the sublimation operation occurs after the step of exposing the patterned substrate to hydrogen, and wherein the at least four sequential steps in combination with the sublimation operation are referred to collectively as an etch cycle.

12. The method of claim 11 wherein the operations are performed sequentially.

13. The method of claim 11 wherein the operations are repeated until a target thickness of the silicon oxide layer is removed.

14. The method of claim 11 wherein the hydrogen-containing precursor is fluorine-free.

15. The method of claim 11 wherein a temperature of the patterned substrate is below 90° C. during the steps of exposing the patterned substrate to hydrogen and exposing the patterned substrate to fluorine.

16. The method of claim 11 wherein the sublimation temperature is greater than 90° C.

17. The method of claim 11 wherein the silicon oxide which forms a wall of the trench is heterogeneous in terms of deposition method but the etch cycle removes between 4 Å and 11 Å of the silicon oxide despite the differing deposition methods.

Assignees

• Applied Materials Inc

Inventors

• Wang Anchuan
• Zhang Jingchun
• Ingle Nitin K
• Lee Young S

Classifications

• H10P50/283 Primary

  by chemical means · CPC title

• B44C1/22

  Removing surface-material, e.g. by engraving, by etching {(for multi-layer articles B44C3/005)} · CPC title

• C03C15/00

  Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) · CPC title

• H01J37/32724

  Temperature · CPC title

• C03C25/68

  by etching · CPC title