Uniformity tuning capable ESC grounding kit for RF PVD chamber

US9087679B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9087679-B2
Application numberUS-201213365876-A
CountryUS
Kind codeB2
Filing dateFeb 3, 2012
Priority dateFeb 9, 2011
Publication dateJul 21, 2015
Grant dateJul 21, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Embodiments of the invention generally relate to a grounding kit for a semiconductor processing chamber, and a semiconductor processing chamber having a grounding kit. More specifically, embodiments described herein relate to a grounding kit which creates an asymmetric grounding path selected to significantly reduce the asymmetries caused by an off center RF power delivery.

First claim

Opening claim text (preview).

What is claimed is: 1. A processing chamber, comprising: a chamber body; a target disposed on the chamber body; an RF power feed coupled to the target in a position that produces an RF power delivery asymmetry; a substrate support electrically coupled the chamber body, the substrate support moveable between raised and lowered positions; a shield surrounding the target and the substrate support; and a grounding kit coupled to and moveable with the substrate support; the g…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9087679B2 cover?
Embodiments of the invention generally relate to a grounding kit for a semiconductor processing chamber, and a semiconductor processing chamber having a grounding kit. More specifically, embodiments described herein relate to a grounding kit which creates an asymmetric grounding path selected to significantly reduce the asymmetries caused by an off center RF power delivery.
Who is the assignee on this patent?
Rasheed Muhammad M, Wang Rongjun, Nguyen Thanh X, and 2 more
What technology area does this patent fall under?
Primary CPC classification H01J37/34. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).