Wafer processing apparatus and wafer processing method
US-2024395512-A1 · Nov 28, 2024 · US
US9087679B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9087679-B2 |
| Application number | US-201213365876-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 3, 2012 |
| Priority date | Feb 9, 2011 |
| Publication date | Jul 21, 2015 |
| Grant date | Jul 21, 2015 |
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Embodiments of the invention generally relate to a grounding kit for a semiconductor processing chamber, and a semiconductor processing chamber having a grounding kit. More specifically, embodiments described herein relate to a grounding kit which creates an asymmetric grounding path selected to significantly reduce the asymmetries caused by an off center RF power delivery.
Opening claim text (preview).
What is claimed is: 1. A processing chamber, comprising: a chamber body; a target disposed on the chamber body; an RF power feed coupled to the target in a position that produces an RF power delivery asymmetry; a substrate support electrically coupled the chamber body, the substrate support moveable between raised and lowered positions; a shield surrounding the target and the substrate support; and a grounding kit coupled to and moveable with the substrate support; the g…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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