Hybrid silicone composition for light emitting device

Patent metadata

Field	Value
Publication number	US-9085651-B2
Application number	US-201313833234-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Oct 19, 2010
Publication date	Jul 21, 2015
Grant date	Jul 21, 2015

Abstract

A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1):

(R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 R 2 SiO 2/2 ) c (R 1 SiO 3/2 ) d (R 2 SiO 3/2 ) e (R 1 2 R 2 SiO 1/2 ) f   (1),

wherein each R 2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, c+e>0, and a+b+c+d+e+f=1; and at least one curing catalyst. The product is ideal for encapsulation of LED (light emitting device) elements.

First claim

The invention claimed is:

1. A curable composition comprising
(A) at least one organopolysiloxane represented by the composition formula (1):
(R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 R 2 SiO 2/2 ) c (R 1 SiO 3/2 ) d (R 2 SiO 3/2 ) e (R 1 2 R 2 SiO 1/2 ) f   (1),

wherein each R 1 independently represents a monovalent organic group having 1 to 20 carbon atoms or an OH group with the proviso that at each silicon-atom bearing no R 2 at least one R 1 represents a monovalent organic group having 1 to 20 carbon atoms, each R 2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a, b, c, d, e, f each represent the fraction of the number of the respective units based on the number of all units of the organopolysiloxane and satisfy a 0, b 0, c≧0, d≧0, e≧0, f≧0 and also satisfy c+e>0 and a+b+c+d+e+f=1; and
(B) at least one curing catalyst; and
wherein the organopolysiloxane is of linear structure represented by the composition formula (3):
(R 1′ 3 SiO 1/2 ) a (R 1′ 2 SiO 2/2 ) b (R 1′ R 2 SiO 2/2 ) c   (3),

wherein each R 1′ independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 20 carbon atoms, each R 2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a, b, c each represent the fraction of the number of the respective units based on the number of all units of the organopolysiloxane and satisfy a>0, b>0, c>0 and a+b+c=1; and
wherein the composition further comprises at least one organopolysiloxane which is of branched structure represented by the composition formula (4):
(R 1′ 3 SiO 1/2 ) a (R 1′ 2 SiO 2/2 ) b (R 1′ R 2 SiO 2/2 ) c (R 1′ SiO 3/2 ) d (R 2 SiO 3/2 ) e   (4),

wherein each R 1′ independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 20 carbon atoms, each R 2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a, b, c, d, e each represent the fraction of the number of the respective units based on the number of all units of the organopolysiloxane and satisfy a>0, b≧0, c≧0, d≧0, e>0 and a+b+c+d+e=1.

2. The curable composition according to claim 1 , wherein the weight ratio of organopolysiloxanes represented by composition formula (3) to organopolysiloxanes represented by composition formula (4) is from 1:5 to 3:1.

3. The curable composition according to claim 1 , wherein the curable composition further comprises at least one oligomeric siloxane of cyclic structure represented by the formula (5):
(R 1′ 2 SiO 2/2 ) m (R 1′ R 2 SiO 2/2 ) n   (5),

wherein each R 1′ independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 20 carbon atoms, each R 2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and m and n each represent the number of the respective units, and m is an integer from 0 to 5, n is an integer from 1 to 5 and 3≦m+n≦9.

4. The curable composition according to claim 1 , wherein each R 2 represents a methacryloxy(n-propyl) group.

5. The curable composition according to claim 1 , wherein the total amount of all organopolysiloxanes is from 20 to 80 wt %, based on the total weight of the curable composition.

6. The curable composition according to claim 1 , wherein the composition comprises at least one methacrylate monomer represented by formula (2):
(H 2 C═C(CH 3 )COO) z R 3   (2),

wherein z is 1, 2 or 3 and R 3 represents a z-valent substituted or unsubstituted hydrocarbon residue the main chain of which may comprise one or more oxygen atoms.

7. The curable composition according to claim 6 , wherein the methacrylate monomer is selected from polyethylene glycol dimethacrylate, citronellyl methacrylate, hydroxypropyl methacrylate, hexanediol dimethacrylate, trimethylolpropanyl trimethacrylate, tetrahydrodicyclopentadienyl methacrylate, triethylene glycol dimethacrylate, isobornyl methacrylate, dicyclopentanyl methacrylate, cyclohexane dimethanol dimethacrylate, tricyclodecane dimethanol dimethacrylate and mixtures thereof.

8. The curable composition according to claim 6 , wherein the weight ratio of the total amount of organopolysiloxanes to the total amount of methacrylate monomers is from 3:1 to 1:3.

9. The curable composition according to claim 1 , wherein the curing catalyst is selected from benzyl peroxide, t-butyl perbenzoate, o-methylbenzyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 1,1-bis(t-butylperoxy)-3,3,5-trimethyl cyclohexane, 1,1-di(t-butylperoxy) cyclohexane, 2,5-dimethyl-2,5-di(t-butylperoxy) hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, di(4-methylbenzoylperoxy)hexamethylene biscarbonate, 1,1-di-(tert-amyl peroxy)cyclohexane and mixtures thereof.

10. A curable composition according to claim 1 as an encapsulant for LED (light emitting devices).

11. A LED (light emitting device) encapsulated by the cured product of a curable composition according to claim 1 .

Assignees

• Henkel Ag & Co Kgaa
• Ablestik Shanghai Ltd

Inventors

• Zhou Jing
• Gillissen Stijn
• Leyssens Karen
• Plantenberg Thomas
• Dunekake Ralf
• Borque Leticia

Classifications

• H10W74/476

  Organic materials comprising silicon · CPC title

• C08L83/06 Primary

  containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence) · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H01L23/296

  Electricity · mapped topic

• C08F20/68 Primary

  Esters · CPC title