Semiconductor device and mounting structure for semiconductor element
US-2024170353-A1 · May 23, 2024 · US
US9084366B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9084366-B2 |
| Application number | US-201113698350-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 16, 2011 |
| Priority date | May 20, 2010 |
| Publication date | Jul 14, 2015 |
| Grant date | Jul 14, 2015 |
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Official abstract text for this publication.
Electric components and methods of manufacture are specified. An electric component comprises a carrier having a recess which penetrates the carrier and also a first chip and external contact area. The first chip is arranged in the recess in the carrier. The external contact area is provided for connecting up the first chip to an external circuit environment.
Opening claim text (preview).
The invention claimed is: 1. An electric component having a shallow physical shape, the electric component being a microphone comprising a carrier having a cutout, a first chip and an external contact area, wherein the cutout having a section, the section penetrating through the carrier, the first chip is arranged in the cutout, the section being filled with the first chip, the first chip being a Microelectromechanical Systems (MEMS) chip, the external contact area is provid…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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