Wired circuit board having enhanced contrast between conductive pattern and insulating layer during inspection

Patent metadata

Field	Value
Publication number	US-9084359-B2
Application number	US-201113137300-A
Country	US
Kind code	B2
Filing date	Aug 4, 2011
Priority date	Sep 6, 2010
Publication date	Jul 14, 2015
Grant date	Jul 14, 2015

Abstract

A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

First claim

What is claimed is:

1. A wired circuit board comprising:
a metal supporting layer;
an insulating base layer that is formed on the metal supporting layer;
a conductive pattern that is formed on a surface of the insulating base layer; and
an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern,
wherein the arithmetic average roughness Ra (JIS B 0601-1994) of the surface of the insulating base layer at least other than a portion whe…

Assignees

• Okamoto Norihiko
• Nitto Denko Corp

Inventors

• Okamoto Norihiko

Classifications

• H05K2203/161

  Electricity · mapped topic

• Y10T29/49004

  Cross-Sectional Technologies · mapped topic

• G11B5/4833 Primary

  Physics · mapped topic

• G11B5/486

  Physics · mapped topic

• H05K1/0269

  Electricity · mapped topic