Composite manufacturing method and apparatus
US-2024308147-A1 · Sep 19, 2024 · US
Microchip and method of manufacturing the same
US9079359B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9079359-B2 |
| Application number | US-201213451722-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 20, 2012 |
| Priority date | Apr 21, 2011 |
| Publication date | Jul 14, 2015 |
| Grant date | Jul 14, 2015 |
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Abstract
Official abstract text for this publication.
Provided are a microchip including a fluid circuit consisting of a space formed therein, a light-absorbing first substrate and a light-transmitting second substrate bonded onto the first substrate, and a groove, having a V-shaped section, extending parallelly to the fluid circuit on a surface of the second substrate opposite to the first substrate on a position immediately above at least part of the fluid circuit and a method of manufacturing the same.
First claim
Opening claim text (preview).
What is claimed is: 1. A microchip, comprising a fluid circuit consisting of a space formed therein, moving a liquid present in said fluid circuit to a desired position in said fluid circuit, including a light-absorbing first substrate and a light-transmitting second substrate bonded onto said first substrate, and further including a groove, having a V-shaped section, extending parallelly to said fluid circuit on a surface of said second substrate opposite to said first substrat…
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Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Cross-Sectional Technologies · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9079359B2 cover?
- Provided are a microchip including a fluid circuit consisting of a space formed therein, a light-absorbing first substrate and a light-transmitting second substrate bonded onto the first substrate, and a groove, having a V-shaped section, extending parallelly to the fluid circuit on a surface of the second substrate opposite to the first substrate on a position immediately above at least part o…
- Who is the assignee on this patent?
- Momose Shun, Takeuchi Hiroki, Rohm Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B29C66/112. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 14 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).