Thermosetting resin composition, thermosetting resin composition for fiber-reinforced composite material, prepared using the same, and honeycomb sandwich panel

US9074091B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9074091-B2
Application numberUS-201013498074-A
CountryUS
Kind codeB2
Filing dateSep 22, 2010
Priority dateSep 25, 2009
Publication dateJul 7, 2015
Grant dateJul 7, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An object of the present invention is to provide a thermosetting resin composition having superior toughness. The thermosetting resin composition of the present invention includes a thermosetting resin, and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler, wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 is satisfied. Formula 1: Adsorption coefficient={Amount (parts by mass) of the thermoplastic resin C adsorbed on 100 parts by mass of the filler/specific gravity of the thermoplastic resin C}/DBP oil absorption (mL/100 g) of the filler.

First claim

Opening claim text (preview).

What is claimed is: 1. A thermosetting resin composition comprising: a thermosetting resin and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler; wherein wherein the thermoplastic resin C comprises polyethersulfone, and an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 below, is satisfied: Adsorption coefficient={Amount (parts by mass) of the thermoplastic resin C adsorbed on 100parts by mass of the filler/specific gravity of the thermoplastic resin C}/DBP oil absorption (mL/100 g) of the filler.  Formula 1 2. A thermosetting resin composition for fiber-reinforced composite material comprising the thermosetting resin composition described in claim 1 . 3. A prepreg obtained by combining reinforced fiber and the thermosetting resin composition for fiber-reinforced composite material described in claim 2 . 4. A honeycomb sandwich panel obtained by layering and curing a honeycomb core and the prepreg described in claim 3 . 5. The thermosetting resin composition according to claim 1 , wherein the thermosetting resin comprises an epoxy resin. 6. The thermosetting resin composition according to claim 1 , wherein a form of the filler is at least one selected from the group consisting of spherical, granular, and irregular. 7. The thermosetting resin composition according to claim 1 , wherein the thermoplastic resin C comprises a functional group that reacts with the thermosetting resin. 8. The thermosetting resin composition according to claim 1 , wherein an amount of the adsorbing filler is from 0.1 to 100 parts by mass per 100 parts by mass of the thermosetting resin. 9. The thermosetting resin composition according to claim 1 , wherein the DBP oil absorption is from 10 to 1000 mL/100 g. 10. The thermosetting resin composition according to claim 1 , wherein the adsorbing filler is dispersed in the thermosetting resin. 11. The thermosetting resin composition according to claim 1 , further comprising a curing agent. 12. A method of manufacturing the thermosetting resin composition described in claim 11 , comprising: a resin mixing process in which a solution comprising the thermosetting resin, the thermoplastic resin C, and the filler, wherein the thermoplastic resin C phase separates from the thermosetting resin at a temperature less than or equal to a UCST or greater than or equal to an LCST, is formed into a one-phase region mixed solution at a temperature exceeding the UCST or lower than the LCST; an adsorption process in which the resin mixed solution is adjusted to a temperature less than or equal to the UCST or greater than or equal to the LCST, the thermoplastic resin C phase separates from the thermosetting resin and the resin mixed solution becomes a two-phase region, the phase separated thermoplastic resin C is adsorbed on the filler and becomes an adsorbing filler, and an adsorbing filler mixture including the adsorbing filler is obtained; and a curing agent mixing process in which the adsorbing filler mixture and the curing agent are mixed. 13. A thermosetting resin composition for fiber-reinforced composite material comprising the thermosetting resin composition obtained by the method described in claim 12 . 14. A method of manufacturing the thermosetting resin composition described in claim 11 , comprising: a resin mixing process in which the thermosetting resin, the thermoplastic resin C, and the filler are formed into a one-phase region mixed solution at a temperature exceeding the UCST or lower than the LCST; an adsorption process in which the resin mixed solution is adjusted to a temperature less than or equal to the UCST or greater than or equal to the LCST, the thermoplastic resin C phase separates from the thermosetting resin and the resin mixed solution becomes a two-phase region, the phase separated thermoplastic resin C is adsorbed on the filler and becomes an adsorbing filler, and an adsorbing filler mixture including the adsorbing filler is obtained; and a curing agent mixing process in which the adsorbing filler mixture and the curing agent are mixed. 15. The thermosetting resin composition according to claim 1 , further comprising a thermoplastic resin B. 16. The thermosetting resin composition according to claim 15 , wherein the thermoplastic resin B comprises a functional group that reacts with the thermosetting resin. 17. The thermosetting resin composition according to claim 1 , wherein the thermosetting resin is an epoxy resin A and, furthermore, comprises a thermoplastic resin B and a curing agent. 18. The thermosetting resin composition according to claim 1 , further comprising a solid resin D and/or an elastomer that is solid at room temperature. 19. A method of manufacturing the thermosetting resin composition described in claim 1 , comprising: a resin mixing process in which a solution comprising the thermosetting resin, the thermoplastic resin C, and the filler, wherein the thermoplastic resin C phase separates from the thermosetting resin at a temperature less than or equal to a UCST or greater than or equal to an LCST, is formed into a one-phase region mixed solution at a temperature exceeding the UCST or lower than the LCST; and an adsorption process in which the resin mixed solution is adjusted to a temperature less than or equal to the UCST or greater than or equal to the LCST, the thermoplastic resin C phase separates from the thermosetting resin and the resin mixed solution becomes a two-phase region, and the phase separated thermoplastic resin C is adsorbed on the filler and becomes an adsorbing filler. 20. A thermosetting resin composition for fiber-reinforced composite material comprising the thermosetting resin composition obtained by the method described in claim 19 . 21. A method of manufacturing the thermosetting resin composition described in claim 1 , comprising: a resin mixing process in which the thermosetting resin, the thermoplastic resin C, and the filler are formed into a one-phase region mixed solution at a temperature exceeding the UCST or lower than the LCST; and an adsorption process in which the resin mixed solution is adjusted to a temperature less than or equal to the UCST or greater than or equal to the LCST, the thermoplastic resin C phase separates from the thermosetting resin and the resin mixed solution becomes a two-phase region, and the phase separated thermoplastic resin C is adsorbed on the filler and becomes an adsorbing filler.

Assignees

Inventors

Classifications

  • Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

  • Polysulfones; Polyethersulfones · CPC title

  • Coated or with bond, impregnation or core · CPC title

  • Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

  • Honeycomb-like · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9074091B2 cover?
An object of the present invention is to provide a thermosetting resin composition having superior toughness. The thermosetting resin composition of the present invention includes a thermosetting resin, and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler, wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 is …
Who is the assignee on this patent?
Kawazoe Masayuki, Ito Tomohiro, Iwata Mitsuhiro, and 1 more
What technology area does this patent fall under?
Primary CPC classification C08L63/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).