Mram device with octagon profile
US-2024135978-A1 · Apr 25, 2024 · US
US9070854B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9070854-B2 |
| Application number | US-201313861017-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 11, 2013 |
| Priority date | Apr 27, 2012 |
| Publication date | Jun 30, 2015 |
| Grant date | Jun 30, 2015 |
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A method of patterning a substrate includes providing a layer stack comprising a plurality of layers on a base portion of the substrate, where the layer stack includes an electrically conductive layer and a magnetic layer. The method further includes forming a first mask feature on an outer surface of the layer stack above a first protected region and a second mask feature on the outer surface of the layer stack above a second protected region, and directing ions towards the layer stack to magnetically isolate and electrically isolate the first protected region from the second protected region.
Opening claim text (preview).
What is claimed is: 1. A method of patterning a substrate comprising: providing a layer stack comprising a plurality of layers on a base portion of the substrate, the layer stack comprising a plurality of initially electrically conductive layers and a magnetic layer; forming a first mask feature on an outer surface of the layer stack above a first protected region and a second mask feature on the outer surface of the layer stack above a second protected region, wherein the first…
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