Light-emitting device
US-12155019-B2 · Nov 26, 2024 · US
Primer composition and optical semiconductor apparatus using same
US9070846B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9070846-B2 |
| Application number | US-201414154675-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 14, 2014 |
| Priority date | Jan 25, 2013 |
| Publication date | Jun 30, 2015 |
| Grant date | Jun 30, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═CH 2 groups in the molecule, and (B) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode formed on the substrate can be prevented, and the heat resistance of a primer itself can be improved.
First claim
Opening claim text (preview).
What is claimed is: 1. A primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device, comprising: (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═CH 2 groups in the molecule, (B) a solvent, and a metal corrosion inhibitor. 2. Th…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10H20/854Primary
Electricity · mapped topic
- H01L33/56Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9070846B2 cover?
- The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═CH 2 groups in the molec…
- Who is the assignee on this patent?
- Shinetsu Chemical Co
- What technology area does this patent fall under?
- Primary CPC classification H10H20/854. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).