Display apparatus and method of manufacturing the same
US-2024419215-A1 · Dec 19, 2024 · US
US9070829B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9070829-B2 |
| Application number | US-201314014409-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 30, 2013 |
| Priority date | Dec 29, 2012 |
| Publication date | Jun 30, 2015 |
| Grant date | Jun 30, 2015 |
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An LED package includes a substrate, a buffer layer formed on the substrate, an epitaxial structure formed on the buffer layer, and a plurality of carbon nanotube bundles formed in the epitaxial structure.
Opening claim text (preview).
What is claimed is: 1. An LED (light emitting diode) chip, comprising: a substrate; a buffer layer formed on the substrate; an epitaxial structure formed on the buffer layer; and a plurality of carbon nanotube bundles formed in the epitaxial structure; wherein the carbon nanotube bundles are arranged radially, and each carbon nanotube bundle is intersected with others at an edge thereof. 2. The LED chip of claim 1 , wherein the epitaxial structure co…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Electricity · mapped topic
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