Stack packages having token ring loops

Patent metadata

Field	Value
Publication number	US-9070570-B2
Application number	US-201414533668-A
Country	US
Kind code	B2
Filing date	Nov 5, 2014
Priority date	Dec 20, 2012
Publication date	Jun 30, 2015
Grant date	Jun 30, 2015

Abstract

Stack packages are provided. The stack package includes a substrate having first and second bond fingers and a plurality of semiconductor chips stacked on the substrate. Each of the plurality of semiconductor chips has an input bonding pad and an output bonding pad. A first interconnection electrically connects the first bond finger to the input bonding pad of a lowermost semiconductor chip of the plurality of semiconductor chips. A second interconnection electrically connects the output bonding pad of a lower semiconductor chip of the plurality of semiconductor chips to the input bonding pad of an upper semiconductor chip stacked on the lower semiconductor chip. A third interconnection electrically connects the output bonding pad of an uppermost semiconductor chip of the plurality of semiconductor chips to the second bond finger.

First claim

What is claimed is:

1. A stack package comprising:
a substrate having a first bond finger, a second bond finger and a third bond finger;
a first semiconductor chip group including a plurality first semiconductor chips stacked on the substrate and a second semiconductor chip group including a plurality of second semiconductor chips stacked on the first semiconductor chip group, each of the first semiconductor chips and the second semiconductor chips having an input bonding pad, a…

Assignees

• Sk Hynix Inc

Inventors

• Lee Ki Yong

Classifications

• H10W90/754

  Electricity · mapped topic

• H10W90/752

  Electricity · mapped topic

• H10W90/734

  Electricity · mapped topic

• H10W90/732

  Electricity · mapped topic

• H10W90/24

  Electricity · mapped topic