Method of joining ceramic parts and articles so formed

US9068464B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9068464-B2
Application numberUS-18840605-A
CountryUS
Kind codeB2
Filing dateJul 25, 2005
Priority dateSep 17, 2002
Publication dateJun 30, 2015
Grant dateJun 30, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for joining a first CMC part ( 30 ) having an outer joining portion ( 32 ), and a second CMC part ( 36 ) having an inner joining portion ( 38 ). The second CMC part ( 36 ) is heat-cured to a stage of shrinkage more complete than that of the first CMC part ( 30 ) prior to joining. The two CMC parts ( 30, 36 ) are joined in a mating interface that captures the inner joining portion ( 38 ) within the outer joining portion ( 32 ). The assembled parts ( 30, 36 ) are then fired together, resulting in differential shrinkage that compresses the outer joining portion ( 32 ) onto the inner joining portion ( 38 ), providing a tightly pre-stressed joint. Optionally, a refractory adhesive ( 42 ) may be used in the joint. Shrinkage of the outer joining portion ( 32 ) avoids shrinkage cracks in the adhesive ( 42 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of forming a joint in a ceramic component, the method comprising: adjoining a first surface of a first ceramic member to a second surface of a second ceramic member; disposing a ceramic matrix composite compression ring about the adjoined surfaces, the first and second ceramic members being cured to a stage of shrinkage greater than a stage of shrinkage of the compression ring; co-firing the first ceramic member, the second ceramic member…

Assignees

Inventors

Classifications

  • Mechanical Engineering · mapped topic

  • Mechanical Engineering · mapped topic

  • Operations & Transport · mapped topic

  • Cross-Sectional Technologies · mapped topic

  • F01D5/282Primary

    Mechanical Engineering · mapped topic

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What does patent US9068464B2 cover?
A method for joining a first CMC part ( 30 ) having an outer joining portion ( 32 ), and a second CMC part ( 36 ) having an inner joining portion ( 38 ). The second CMC part ( 36 ) is heat-cured to a stage of shrinkage more complete than that of the first CMC part ( 30 ) prior to joining. The two CMC parts ( 30, 36 ) are joined in a mating interface that captures the inner joining portion ( 38 …
Who is the assignee on this patent?
Morrison Jay A, Lane Jay E, Merrill Gary B, and 1 more
What technology area does this patent fall under?
Primary CPC classification F01D5/282. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jun 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).