Polishing apparatus
US-9522453-B2 · Dec 20, 2016 · US
Polishing method
US9067296B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9067296-B2 |
| Application number | US-201213454146-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 24, 2012 |
| Priority date | Apr 28, 2011 |
| Publication date | Jun 30, 2015 |
| Grant date | Jun 30, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.
First claim
Opening claim text (preview).
What is claimed is: 1. A polishing method for polishing a substrate by keeping the substrate in sliding contact with a surface of a polishing pad while supplying a polishing liquid to the surface of the polishing pad, the polishing method comprising: determining, in advance, a first relationship between a supply flow rate of a polishing liquid and a polishing rate when a substrate is polished without controlling a surface temperature of the polishing pad, a second relationship bet…
Assignees
Inventors
Classifications
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B24B37/015Primary
Operations & Transport · mapped topic
- H10P52/00Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9067296B2 cover?
- A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply …
- Who is the assignee on this patent?
- Ono Katsutoshi, Ishii Yu, Matsuo Hisanori, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification B24B37/015. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jun 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).