Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
Wiring board and method for manufacturing the same
US9066439B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9066439-B2 |
| Application number | US-201213483587-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 30, 2012 |
| Priority date | Jul 14, 2011 |
| Publication date | Jun 23, 2015 |
| Grant date | Jun 23, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A wiring board, comprising: a first multilayer wiring board comprising a first solder-resist layer; a second multilayer wiring board connected to the first multilayer wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first multilayer wiring board; and a third multilayer wiring board connected to the first multilayer wiring board and positioned in a second opening portion formed in the first solder-resis…
Assignees
Inventors
Classifications
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K1/141Primary
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9066439B2 cover?
- A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the fir…
- Who is the assignee on this patent?
- Segawa Hiroshi, Naganuma Nobuyuki, Takahashi Michimasa, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H05K1/141. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 23 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).