Microstructured adhesive article

US9065675B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9065675-B2
Application numberUS-98811409-A
CountryUS
Kind codeB2
Filing dateMar 27, 2009
Priority dateApr 22, 2008
Publication dateJun 23, 2015
Grant dateJun 23, 2015

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Abstract

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Adhesive articles including transfer tapes and labels are described. The adhesive articles include a low elastic modulus adhesive on a microstructured release liner having a high coefficient of friction release surface. Improvements in die cut quality and razor slit edge quality are shown.

First claim

Opening claim text (preview).

What is claimed is: 1. An adhesive article comprising a release liner comprising a microstructured release layer, an adhesive having a first major surface in contact with the release layer, and a substrate in contact with a second major surface of the adhesive; wherein the release layer has an unstructured coefficient of friction of at least 0.4, wherein the microstructured release layer comprises a microstructure having a depth of at least 5 microns, and wherein the unstructured c…

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What does patent US9065675B2 cover?
Adhesive articles including transfer tapes and labels are described. The adhesive articles include a low elastic modulus adhesive on a microstructured release liner having a high coefficient of friction release surface. Improvements in die cut quality and razor slit edge quality are shown.
Who is the assignee on this patent?
Seth Jayshree, Boulos Marie A, Venne Janet A, and 1 more
What technology area does this patent fall under?
Primary CPC classification H04L12/40032. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 23 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).