High-speed, half-duplex communication with standard microcontroller
US-2024250844-A1 · Jul 25, 2024 · US
US9065675B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9065675-B2 |
| Application number | US-98811409-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 27, 2009 |
| Priority date | Apr 22, 2008 |
| Publication date | Jun 23, 2015 |
| Grant date | Jun 23, 2015 |
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Adhesive articles including transfer tapes and labels are described. The adhesive articles include a low elastic modulus adhesive on a microstructured release liner having a high coefficient of friction release surface. Improvements in die cut quality and razor slit edge quality are shown.
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What is claimed is: 1. An adhesive article comprising a release liner comprising a microstructured release layer, an adhesive having a first major surface in contact with the release layer, and a substrate in contact with a second major surface of the adhesive; wherein the release layer has an unstructured coefficient of friction of at least 0.4, wherein the microstructured release layer comprises a microstructure having a depth of at least 5 microns, and wherein the unstructured c…
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