Gate Dielectric for Gate Leakage Reduction
US-2024266415-A1 · Aug 8, 2024 · US
US9064853B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9064853-B2 |
| Application number | US-201213572847-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 13, 2012 |
| Priority date | Aug 19, 2011 |
| Publication date | Jun 23, 2015 |
| Grant date | Jun 23, 2015 |
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A semiconductor device including an oxide semiconductor and including a more excellent gate insulating film is provided. A highly reliable and electrically stable semiconductor device having a small number of changes in the film structure, the process conditions, the manufacturing apparatus, or the like from a mass production technology that has been put into practical use is provided. A method for manufacturing the semiconductor device is provided. The semiconductor device includes a gate electrode, a gate insulating film formed over the gate electrode, and an oxide semiconductor film formed over the gate insulating film. The gate insulating film includes a silicon nitride oxide film, a silicon oxynitride film formed over the silicon nitride oxide film, and a metal oxide film formed over the silicon oxynitride film. The oxide semiconductor film is formed over and in contact with the metal oxide film.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a gate electrode; a gate insulating film comprising a silicon nitride oxide film over the gate electrode, a silicon oxynitride film over the silicon nitride oxide film, and a metal oxide film over the silicon oxynitride film; an oxide semiconductor film over and in contact with the metal oxide film; a source electrode and a drain electrode over the oxide semiconductor film; and a protective film over and in contact with the oxide semiconductor film, the source electrode, and the drain electrode, wherein the oxide semiconductor film comprises a c-axis aligned crystalline oxide semiconductor, wherein the oxide semiconductor film is an In—Ga—Zn-based oxide film, and wherein the metal oxide film is a Ga—Zn-based oxide film. 2. The semiconductor device according to claim 1 , wherein the silicon nitride oxide film has a larger thickness than the silicon oxynitride film. 3. The semiconductor device according to claim 1 , wherein the metal oxide film has a smaller thickness than the silicon nitride oxide film. 4. The semiconductor device according to claim 1 , wherein the oxide semiconductor film includes at least one of oxides of indium, zinc, gallium, zirconium, tin, gadolinium, titanium, and cerium. 5. The semiconductor device according to claim 1 , wherein an average surface roughness of the gate insulating film is less than or equal to 1 nm. 6. A display device comprising a transistor, the transistor comprising: a gate electrode; a gate insulating film comprising a silicon nitride oxide film over the gate electrode, a silicon oxynitride film over the silicon nitride oxide film, and a metal oxide film over the silicon oxynitride film; an oxide semiconductor film over and in contact with the metal oxide film; a source electrode and a drain electrode over the oxide semiconductor film; and a protective film over and in contact with the oxide semiconductor film, the source electrode, and the drain electrode, wherein the oxide semiconductor film comprises a c-axis aligned crystalline oxide semiconductor, wherein the oxide semiconductor film is an In—Ga—Zn-based oxide film, and wherein the metal oxide film is a Ga—Zn-based oxide film. 7. The display device according to claim 6 , wherein the silicon nitride oxide film has a larger thickness than the silicon oxynitride film. 8. The display device according to claim 6 , wherein the metal oxide film has a smaller thickness than the silicon nitride oxide film. 9. The display device according to claim 6 , wherein the display device comprises a liquid crystal element. 10. The display device according to claim 6 , wherein the display device comprises an organic electroluminescent element.
Amorphous oxide semiconductors · CPC title
Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate · CPC title
having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device · CPC title
of thin-film transistors [TFT] · CPC title
characterised by the insulator, e.g. by the gate insulator · CPC title
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