Technique for processing a substrate

US9064795B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9064795-B2
Application numberUS-201313832578-A
CountryUS
Kind codeB2
Filing dateMar 15, 2013
Priority dateMar 30, 2012
Publication dateJun 23, 2015
Grant dateJun 23, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Techniques for processing a substrate are disclosed. In one exemplary embodiment, the technique may be realized as a method for processing a substrate, the method comprising: ionizing first material and second material in an ion source chamber of an ion source, the first material being boron (B) containing material, the second material being one of phosphorous (P) containing material and arsenic (As) containing material; generating first ions containing B and second ions containing one of P and As; and extracting the first and second ions from the ion source chamber and directing the first and second ions toward the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for processing a substrate, the method comprising: ionizing first material and second material in an ion source chamber of an ion source, the first material being boron (B) containing material, the second material being one of phosphorous (P) containing material and arsenic (As) containing material; generating first ions containing B and second ions containing one of P and As; and extracting the first and second ions from the ion source chamber and directing the first and second ions toward the substrate, wherein one of the first and second materials is provided as a solid source in the ion source chamber and the other one of the first and second material is provided as a gas released into the ion source chamber. 2. The method according to claim 1 , wherein the solid source is disposed on an ion source chamber wall of the ion source chamber. 3. The method according to claim 1 , wherein the ion source further comprises a dielectric window and RF source, wherein the solid source is disposed on the dielectric window.

Assignees

Inventors

Classifications

  • H10P30/20Primary

    into semiconductor materials, e.g. for doping · CPC title

  • Ion sources; Ion guns · CPC title

  • Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece, (H01J37/3244 takes precedence; environmental cells for electron microscopes H01J2237/2003; microscopes with environmental specimen chamber H01J2237/2608) · CPC title

  • Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube · CPC title

  • for ion implantation · CPC title

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What does patent US9064795B2 cover?
Techniques for processing a substrate are disclosed. In one exemplary embodiment, the technique may be realized as a method for processing a substrate, the method comprising: ionizing first material and second material in an ion source chamber of an ion source, the first material being boron (B) containing material, the second material being one of phosphorous (P) containing material and arseni…
Who is the assignee on this patent?
Varian Semiconductor Equipment
What technology area does this patent fall under?
Primary CPC classification H10P30/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 23 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).