Laminated chip electronic component, board for mounting the same, and packing unit thereof
US-8934215-B2 · Jan 13, 2015 · US
Multilayer ceramic electronic component and board for mounting the same
US9064639B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9064639-B2 |
| Application number | US-201313952573-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 26, 2013 |
| Priority date | Apr 26, 2013 |
| Publication date | Jun 23, 2015 |
| Grant date | Jun 23, 2015 |
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Abstract
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There is provided a multilayer ceramic electronic component includes: a ceramic body including dielectric layers stacked therein and satisfying T(thickness)/W(width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body, having the dielectric layer disposed therebetween, and alternately exposed through end surfaces of the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to upper and lower main surfaces of the ceramic body wherein, when a height of the ceramic body is defined as a, and a distance from an upper end of the first or second external electrode formed on the upper main surface of the ceramic body to a lower end of the first or second external electrode formed on the lower main surface of the ceramic body is defined as b, 0.990≦a/b<1 is satisfied.
First claim
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What is claimed is: 1. A multilayer ceramic electronic component comprising: a ceramic body including a plurality of dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer disposed therebetween, and alternately exposed through both end surfaces of the…
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- What does patent US9064639B2 cover?
- There is provided a multilayer ceramic electronic component includes: a ceramic body including dielectric layers stacked therein and satisfying T(thickness)/W(width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body, having the dielectric layer disposed therebetween, and alternately exposed through end surfaces of the ceramic body; and first and second ex…
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 23 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).