Underlayer composition and method of manufacturing a semiconductor device
US-2024369932-A1 · Nov 7, 2024 · US
US9063418B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9063418-B2 |
| Application number | US-201414300996-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 10, 2014 |
| Priority date | Feb 27, 2012 |
| Publication date | Jun 23, 2015 |
| Grant date | Jun 23, 2015 |
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A photosensitive resin composition which is high in thermal decomposition property of a photocured product thereof even in a case of being subjected to heat treatment in a non-oxygen atmosphere and is less likely to generate a residue of carbon and a photosensitive paste composed of the same are provided. The composition contains (a) a photopolymerization initiator, (b) an acryl monomer, and (c) polyalkylene carbonate, in which a ratio of polyalkylene carbonate to a total amount of the acryl monomer and polyalkylene carbonate is not lower than 50 weight % and not higher than 90 weight %. Polypropylene carbonate is used as polyalkylene carbonate. The photosensitive paste is obtained by blending the photosensitive composition, a solvent, and inorganic powders. Insulating inorganic material powders or conductive metal powders are employed as the inorganic powders.
Opening claim text (preview).
The invention claimed is: 1. A photosensitive resin composition, comprising: (a) a photopolymerization initiator; (b) an acryl monomer; and (c) polypropylene carbonate, wherein an amount of said polypropylene carbonate is between 50 and 90 weight % of a total amount of said acryl monomer and said polypropylene carbonate. 2. A photosensitive paste, comprising: the photosensitive resin composition according to claim 1 ; a solvent; and inorganic powd…
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